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  • Isikhululo esiphindwe kabini sobushushu obungaguqukiyo kumatshini wokuthambisa we-laser

Isikhululo esiphindwe kabini sobushushu obungaguqukiyo kumatshini wokuthambisa we-laser

Inkcazelo emfutshane:

Isikhululo esiphindwe kabini ubushushu obungaguqukiyo umatshini wokuthambisa we-laser luhlobo olutsha lwezixhobo eziphuhliswe nguHerolaser.Isixhobo sihambisa i-welding ezinzileyo engaqhagamshelwanga nge-laser diode (LD) njengomthombo wobushushu onikwe ingxelo yangaphakathi evaliweyo kunye nokubeka iliso lobushushu bexesha langempela.

 

 

 

 


Iinkcukacha zeMveliso

Iimpawu zeempawu

Ividiyo

Khuphela

Indlela yokuodola

Intshayelelo yeMveliso

Isixhobo sineendlela zokusebenza ezininzi kunye nenkqubo yokutya okuzenzekelayo ngocingo okanye isixhobo sokuhambisa i-solder esichanekileyo esichanekileyo sokuhambisa isixhobo sokuthengisa ngokugqibeleleyo kwiimeko ezahlukeneyo.Kwiimveliso ezithile ezichanekileyo ezingenakukwazi ukujongana ne-reflow soldering kunye ne-wave soldering machine, umatshini we-laser soldering uya kuba yinto yakho ethembekileyo yokuthengisa iimveliso zakho ezinikwe iimpawu zesakhiwo esizinzile, ukuphumelela kweendleko, ukusebenza okuphezulu kwe-soldering kunye ne-teknoloji yokulawula amanani.

 

IParameter yobuGcisa

Hayi.

Into

Ipharamitha

1

 Umzekelo I-ML-WS-XF-ZD2-HW80

2

 Amandla eLaser 60W-200W

3

 Uhlobo lweLaser isemiconductor

4

 Ubude bengqwalasela 80/125/160mm(ngokuzikhethela）

5

 Uluhlu lolawulo lobushushu 60°C-400°C

6

 Ukuchaneka kweNkqubo yobushushu ±( 0.3% ukufunda + 2°C) (ubushushu be-ambient 23±5°C)

7

 IGPS ICoaxial CCD esweni kunye

indawo yeCCD

8

 Ubungakanani besixhobo 1100mm*1450mm*1750mm

9

 Uluhlu lwe-welding 250mm * 250mm(isikhululo esisodwa sokusebenza）

10

 Ukutya istroke 1000mm

11

 Inani leezembe ezishukumayo 6 izembe(X1 Y1 Z1/X2 Y2 Z2)

12

 Ukuphindaphinda ±0.02mm

13

 Inkqubo yokususa uthuli Inkqubo yokucoca i-soot ezenzekelayo

14

 Ubunzima obupheleleyo 350Kg

15

 Amandla onke ≤2.5KW

Iimpawu eziphambili

1. Yamkela i-laser semiconductor laser, esebenza ngendlela engasebenziyo.

2. Akukho ukusetyenziswa kwentsimbi ye-soldering, ehamba ngexabiso eliphantsi kunye nokugcinwa okulula.

3. Indawo yesoda ebonwayo ngokusetyenziswa kwe-Dual vision application kunye nenkqubo yokubeka iliso yeCCD.

4. I-Laser icutshungulwa phantsi kobushushu obungaguqukiyo ngempendulo yangaphakathi evaliweyo yokubeka iliso lobushushu ngexesha langempela.

5. Indawo ye-welding inokulungelelaniswa ukuhlangabezana nobukhulu obuhlukeneyo be-soldering.

6. Beka inkqubo yokucoca umsi ukususa kwangethuba intsalela evuthayo ekutshayo.

7. Ukhetho lokutshintshela phakathi kwesitishi esinye kunye nemodi yesitishi esiphindwe kabini.

Isampulu yokuBonisa

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